報(bào)告題目：Microbridge Tests
報(bào)告人：Prof. Tongyi Zhang (張統(tǒng)一)
報(bào)告時(shí)間：
報(bào)告地點(diǎn)：浙江大學(xué)玉泉校區(qū)教12-118
報(bào)告摘要：
In the present work, we summarize the novel microbridge testing method for mechanical characterization of thin films including single-layer, bilayer, trilayer, and multilayer thin films. The samples for microbridge tests were prepared with the microelectromechanical fabrication technique such that they were easy to be handled with. The microbridge tests were conducted with a load and displacement sensing nanoindenter system equipped with a microwedge probe. The length of the microwedge probe is larger than the width of microbridge samples, which makes one-dimensional analysis appropriate. In mechanics analysis, we modeled the substrate deformation with three coupled springs and considered residual stress in each layer, thereby resulting in a closed-form formula of deflection versus load. The microbridge testing method allows us to simultaneously evaluate the Young’s modulus, residual stress and bending fracture strength of single-layer films from an experimental load-deflection curve. The mechanics analysis shows that four parameters, bending stiffness, tensile stiffness, residual resultant force and residual moment, determine the bending behavior of a multilayer beam including the initial deflection caused only by residual moment and residual resultant force without any applied loads. An experimental procedure was developed to determine the four parameters. In addition to the characterization of elastic behaviors of thin films, the microbridge test has been extended to investigate the plastic behavior of thin films. Examples to demonstrate the developed microbridge test will be illustrated on single-layer, bilayer and trilayer films. The microbridge test is further developed to the nanobridge test, in which the adhesion between the probe and a tested nanowire must be considered.
報(bào)告人簡(jiǎn)介：
張統(tǒng)一教授是我國(guó)自己培養(yǎng)、在香港科技大學(xué)成長(zhǎng)的學(xué)者。他于1982年和1985年在北京科技大學(xué)材料物理專業(yè)獲碩士和博士學(xué)位。畢業(yè)后獲得德國(guó)洪堡基金會(huì)獎(jiǎng)學(xué)金，1986―1988年在德國(guó)哥廷根大學(xué)任研究員。1988―1990年在美國(guó)羅徹斯特大學(xué)進(jìn)行博士后研究。1990―1993年在美國(guó)耶魯大學(xué)任副研究員。1993年到香港科技大學(xué)任教至今，目前是該校講座教授。研究領(lǐng)域包括鐵電與壓電材料的多場(chǎng)斷裂力學(xué)、微納觀力學(xué)和氫滲透與氫致開裂。他是2007年度國(guó)家自然科學(xué)二等獎(jiǎng)第一獲獎(jiǎng)人（共四位獲獎(jiǎng)人）和1987年度自然科學(xué)二等獎(jiǎng)第三獲獎(jiǎng)人（共十位獲獎(jiǎng)人）。2003年獲香港裘槎高級(jí)研究學(xué)者獎(jiǎng)，2001年獲美國(guó)ASM International Fellow Award，1988年獲中國(guó)科學(xué)技術(shù)協(xié)會(huì)青年科技獎(jiǎng)。他發(fā)表139篇SCI學(xué)術(shù)論文。5次收到Web of Science賀卡，祝賀他的“文章引用率在所從事領(lǐng)域位于1％前列，工作在領(lǐng)域里有重大的影響力”。截至2009年3月30日，他的論文SCI他引次數(shù)為1776次；其中在香港科技大學(xué)完成的4篇學(xué)術(shù)論文SCI他引次數(shù)為234、169、119和117次。獲得2項(xiàng)美國(guó)專利。在國(guó)際和國(guó)內(nèi)學(xué)術(shù)會(huì)議上作特邀、主題和大會(huì)報(bào)告32次，并將在第12屆國(guó)際斷裂大會(huì)上作大會(huì)報(bào)告。組織和參與組織包括第八屆國(guó)際斷裂基礎(chǔ)大會(huì)在內(nèi)的3次國(guó)際會(huì)議。為國(guó)際和國(guó)內(nèi)學(xué)報(bào)編輯了八期特刊。
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